- Dual side heating with linear halogen lamps
– Reduced stress minimized pattern effects
– Higher total power density for flash anneal capabilities
- Non-contact edge guard ring, along with sharp quartz
– pins ensure better inherent uniformity and zero slip line
generation.
- Field proven RippleTM pyrometry
– Reliable and repeatable process results
– Emissivity compensation
– High tolerance to deposits on chamber quartzware
- Dual chamber configuration & single atmospheric front end
- identical and independent process modules for 300mm wafer size
- Single atmospheric, linear handler serving 3 FOUP loadports
- Faster dual arm robot
- Central cooling station including slots for dummy wafers
- Dynamic uniformity control and novel temperature controller for improved transient temperature uniformity and ease of use